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AssigneeInternational Business Machines Corporation
InventorsAli Afzali-Ardakani, Devendra Sadana, Lidija Sekaric
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A semiconductor device and a method of fabricating a semiconductor device are disclosed. Embodiments of the invention use a photosensitive self-assembled monolayer to pattern the surface of a substrate into hydrophilic and hydrophobic regions, and an aqueous (or alcohol) solution of a dopant compound is deposited on the substrate surface. The dopant compound only adheres on the hydrophilic regions. After deposition, the substrate is coated with a very thin layer of oxide to cap the compounds, and the substrate is annealed at high temperatures to diffuse the dopant atoms into the silicon and to activate the dopant. In one embodiment, the method comprises providing a semiconductor substrate including an oxide surface, patterning said surface into hydrophobic and hydrophilic regions, depositing a compound including a dopant on the substrate, wherein the dopant adheres to the hydrophilic region, and diffusing the dopant into the oxide surface of the substrate.
A method of using alternating hydrophobic and hydrophilic regions to form a patterned dopant region in a semiconductor device, the method comprising:
A method of using alternating hydrophobic and hydrophilic regions to form a patterned dopant region in a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.