Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
AssigneeSoitec
InventorsDaniel Delprat, Carine Duret, Nadia Ben-Mohamed, Fabrice Lallement
Life of this patent
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Abstract
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, by generating a weakening zone in the source substrate; contacting the source substrate and the glass-based support substrate; and splitting the source substrate at the weakening zone; wherein the glass-based substrate has a thickness of between 300 μm and 600 μm.
Claims14
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, which comprises:
- generating a weakening zone in the source substrate with the weakening zone defining the thickness of the layer to be transferred;
- contacting the source substrate and a glass-based support substrate that has a thickness of only between 300 μm and less than 500 μm;
- and
- splitting the source substrate at the weakening zone to transfer the layer to the glass-based support substrate.
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, which comprises:
- generating a weakening zone in the source substrate with the weakening zone defining the thickness of the layer to be transferred;
- contacting the source substrate and a glass-based support substrate that has a thickness of only between 300 μm and less than 500 μm;
- and
- splitting the source substrate at the weakening zone to transfer the layer to the glass-based support substrate, wherein the at least one superficial layer is a trilayer of SiO2/SiNx/SiO2 formed on the source substrate.
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, which comprises:
- generating a weakening zone in the source substrate with the weakening zone defining the thickness of the layer to be transferred;
- directly contacting the source substrate and a glass-based support substrate that has a thickness of only between 300 μm and less than 500 μm;
- and
- splitting the source substrate at the weakening zone to transfer the layer to the glass-based support substrate without intervening layers therebetween.
Dependencies are inferred from the claim text.