Chip package and method of forming the same
AssigneeInfineon Technologies AG
InventorsHolger Torwesten, Manfred Mengel, Stefan Schmid, Soon Lock Goh, Swee Kah Lee
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Abstract
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
Claims9
A method of forming a chip package, the method comprising:
- attaching at least one chip on a carrier, the chip comprising a plurality of chip pads on a surface of the chip opposite to the carrier;
- depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer comprising tin or indium;
- depositing a second adhesion layer on the first adhesion layer, the second adhesion layer comprising a silane organic material;
- and
- depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
Dependencies are inferred from the claim text.