LED with thin package struture and method for manufacturing the same

A method for manufacturing an LED (light emitting diode), comprising:

• providing a metal substrate;
• etching the metal substrate to form a chip fastening area with a depression in the metal substrate, and two wire fixing areas on the metal substrate, a plurality of first grooves being defined between the chip fastening area and the wire fixing areas;
• providing an LED chip in the depression of the chip fastening area and electrically connected to the two wire fixing areas by wires;
• forming an encapsulant covering chip fastening area and the wire fixing areas and filling in the first grooves;
• and
• removing the metal substrate except portions which are formed as the chip fastening area and the wire fixing areas;
• wherein the metal substrate comprises a first metal layer and a second metal layer which are made of a same material;
• wherein the chip fastening area and the wire fixing areas are defined in the second metal layer, and gaps are defined between the chip fastening area and the wire fixing areas in the second metal layer;
• and
• wherein a middle portion of the chip fastening area of the second metal layer and a portion of the first metal layer which is corresponding to the middle portion of the chip fastening area are etched to define the depression for receiving the LED chip.