Methods for manufacturing light emitting diode and light emitting device
AssigneeEnraytek Optoelectronics Co., Ltd.
InventorRichard Rugin Chang
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Abstract
The present invention provides manufacturing methods of an LED and a light emitting device. The manufacturing method of the LED includes: providing a substrate; forming on the substrate an LED chip and a second electrode successively; forming a lens structure covering the second electrode; coating the lens structure with fluorescent powder; forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip; and filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material. The LED has a high luminous efficiency and the manufacturing method is easy to implement.
Claims16
A method for manufacturing an LED comprising:
- providing a substrate;
- forming on the substrate an LED chip and a second electrode successively;
- forming a lens structure covering the second electrode;
- coating the lens structure with fluorescent powder;
- forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip;
- and
- filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material.
A method for manufacturing a light emitting device, comprising:
- providing a base which including a assembly groove;
- forming an LED;
- and
- fixing the LED on the bottom of the assembly groove of the base;
- wherein forming the LED comprises:
- providing a substrate;
- forming on the substrate an LED chip and a second electrode successively;
- forming a lens structure covering the second electrode;
- coating the lens structure with fluorescent powder;
- forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip;
- and
- filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material.
Dependencies are inferred from the claim text.