Lead frame and manufacturing method thereof

#This application is the U.S. national stage application of International Patent Application No. PCT/KR2009/005057, filed Sep. 7, 2009, which claims priority to Korean Application No. 10-2008-0087689, filed Sep. 5, 2008, the disclosures of each of which are incorporated herein by reference in their entirety.

#The embodiment relates to a lead frame and a method for manufacturing the same.

#A lead frame is one of components of a semiconductor package together with a semiconductor chip.

#FIG. 1 is a sectional view showing a lead frame according to a first embodiment.

#FIGS. 2 and 3 are enlarged views showing the surface of a rough copper layer according to the first embodiment;

#FIG. 4 is a view showing a method for manufacturing the lead frame according to the first embodiment;

#In the description of embodiments, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being ‘on’ or ‘under’ a substrate, another layer (or film), region, pad, or pattern, it can be directly ‘on’ or ‘under’ the substrate, another layer (or film), region, pad, or other patterns, or one or more intervening layer may be present.

#In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience of explanation and the sizes of elements do not totally reflect the actual sizes of the elements.

#FIG. 1 is a sectional view showing a lead frame according to a first embodiment.