Integrated electronic assembly for conserving space in a circuit
AssigneeCoilcraft, Incorporated
InventorStephen Michael Sedio
Life of this patent
Estimating the term…
Abstract
An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
Claims14
An integrated electronic assembly comprising:
- a discrete electronic component;
- an integrated circuit incorporated into the discrete electronic component in order to form an integrated electronic assembly;
- wherein the discrete electronic component is a coil component having:
- a body defining a first opening into which the integrated circuit is disposed so that the body and integrated circuit may be picked and placed as a single assembly;
- metalized pads connected to the body for electrically and mechanically connecting the integrated electronic assembly to a substrate;
- and
- a wire having first and second ends which are connected to respective metalized pads on the body and wound about the body to form a coil through which current may travel.
An integrated electronic assembly comprising:
- an integrated circuit having a generally flat upper surface with which the integrated circuit may be picked and placed on a substrate using conventional pick-and-place equipment;
- and
- a first discrete electronic component having a footprint of a specified size for mounting the first discrete electronic component to the substrate and a body having a generally flat upper surface with which the first discrete electronic component can be picked and placed on the substrate using conventional pick-and-place equipment, the body further defining a first recess in a bottom surface of the body and into which at least a portion of the integrated circuit is disposed so that the first discrete electronic component is stacked on top of the integrated circuit and the integrated circuit may be mounted to the substrate within the footprint of the first discrete electronic component thereby reducing the amount of space that is taken up by the discrete electronic component and the integrated circuit.
An integrated electronic assembly comprising:
- a first finished electronic component defining a cavity and having a generally flat upper surface with which the first finished electronic component may be picked and placed on an outer surface of a substrate using conventional pick-and-place equipment;
- a second finished electronic component having a generally flat upper surface with which the second finished electronic component may be picked and placed on the outer surface of the substrate using conventional pick-and-place equipment, the second finished electronic component being disposed within the cavity of the first finished electronic component such that the first and second electronic components may be mounted to the outer surface of the substrate in such a way that conserves space on the outer surface of the substrate and wherein the first and second finished electronic components are mounted to the outer surface of the substrate in such a way as to allow for the circulation of air about the second finished electronic component when the components are mounted to the substrate.
An integrated electronic assembly comprising:
- a coil positioned in an upper portion of the electronic assembly and located in a first horizontal plane;
- an integrated circuit positioned in a lower portion of the electronic assembly and located in a second horizontal plane separate from and parallel to the first horizontal plane, both the coil and integrated circuits having generally flat upper surfaces with which the coil and integrated circuit may be picked and placed on substrate using conventional pick-and-place equipment;
- and
- wherein the coil is connected to a base that has portions extending down from the base and coil on opposite sides of the integrated circuit to provide spacing or a recess within which the integrated circuit may be mounted.
An electronic assembly comprising:
- a first discrete electronic component comprising a coil and having a body with portions that extend down on opposite sides of the body to define spacing or a recess within which a second electronic component may be disposed, the coil being positioned in a first horizontal plane and the spacing or recess defined by the body being positioned in a second horizontal plane separate from and parallel to the first horizontal plane, the first discrete electronic component further having a generally flat upper surface that the first discrete electronic component may be picked-and-placed with using conventional pick-and-place equipment.
Dependencies are inferred from the claim text.