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US 8,945,677 B2Granted
Electronic device manufacture using low-k dielectric materials
AssigneeAspen Aerogels, Inc.
InventorsNicholas A. Zafiropoulos, Paul Nahass, Roxana Trifu, Redouane Begag, Wendell E. Rhine, Wenting Dong, Shannon White, George L. Gould, Alaric Naiman, Roger Sinta
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Abstract
Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
Claims18
A method for producing a low-k dielectric component suitable for an electronic device comprising the steps of:
- a) disposing on to a substrate a layer of pre-sol composition comprising a polyamic acid pre-sol, a catalyst and a polar, aprotic solvent,
- b) curing the pre-sol composition to form a wet-gel material,
- c) removing the solvent using supercritical fluid to provide a polyimide aerogel film, and
- d) capping a surface of the polyimide aerogel film away from the substrate with at least one non-porous, low-k dieletric material.
1 more element
Dependencies are inferred from the claim text.