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US 8,945,344 B2Granted
Systems and methods of separating bonded wafers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsXin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai
Life of this patent
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Abstract
Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
Claims16
A system comprising:
- a support for bonded wafers;
- a debonding mechanism configured to apply a first twisting sheer force to a top wafer of the bonded wafers and a second twisting sheer force to a bottom wafer of the bonded wafers;
- a first vacuum mechanism configured to apply a vacuum to the bonded wafers;
- a chamber enclosing the support and the debonding mechanism;
- and
- a second vacuum mechanism configured to apply a vacuum to the chamber.
3 more elements
A system for separating bonded semiconductor wafers, the system comprising:
- a chamber;
- a first stage disposed in the chamber, the first stage including a first vacuum line and being adapted to support the bonded semiconductor wafers;
- a second stage disposed in the chamber proximate the first stage, the second stage including a second vacuum line;
- a first ball screw coupled to the second stage;
- a first servo motor for applying a first twisting sheer force coupled to the first ball screw;
- a second ball screw coupled to the first stage;
- a second servo motor for applying a second twisting sheer force coupled to the second ball screw;
- and
- a third vacuum line coupled to the chamber.
6 more elements
A method comprising:
- placing bonded wafers on a support disposed in a chamber, the bonded wafers including a top wafer and a bottom wafer coupled to the top wafer;
- applying a first twisting force to the top wafer and a second twisting force to the bottom wafer to separate the bonded wafers;
- and
- applying a vacuum to the chamber.
1 more element
Dependencies are inferred from the claim text.