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US 8,945,336 B2Granted
Wiring substrate and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsAtsushi Nakamura, Mitsuyoshi Imai
Life of this patent
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Abstract
A wiring substrate includes an adhesive layer, a wiring layer, and a support substrate. The adhesive layer includes a first surface and a second surface that is opposite to the first surface. The wiring layer is formed on the first surface of the adhesive layer. The support substrate is formed on the second surface of the adhesive layer. The wiring layer is partially exposed in a through hole extending through the adhesive layer and the support substrate in a thicknesswise direction. The support substrate is adhered to the adhesive layer in a removable manner.
Claims10
A wiring substrate comprising:
- an adhesive layer including a first surface and a second surface that is opposite to the first surface;
- a wiring layer formed on the first surface of the adhesive layer;
- and
- a support substrate formed on the second surface of the adhesive layer, wherein
- the wiring layer is partially exposed in a through hole extending through the adhesive layer and the support substrate in a thickness-wise direction, and
- the support substrate is adhered to the adhesive layer in a removable manner such that the support substrate is peelable from the adhesive layer,
- wherein the adhesive layer is a thermally cured adhesive layer that has a first adhesive force that adheres the wiring layer to the adhesive layer and a second adhesive force that adheres the support substrate to the adhesive layer, and the first adhesive force is stronger than the second adhesive force.
4 more elements
Dependencies are inferred from the claim text.