Adhesive stack with a central shear layer
AssigneeApple Inc.
InventorMatthew P. Casebolt
Life of this patent
Estimating the term…
Abstract
An adhesive stack may comprise a shear layer positioned between two adhesive layers, wherein the shear layer is designed to fail upon application of a deliberate and appropriate shear force and before the failure of the adhesive layers. The adhesive stack may aid in securing components within an electronic device to prevent movement of the component when the device is dropped, hit, or bumped. The adhesive stack may occupy minimal space within the device, and reduce the cost of securing the component within the device's interior. The adhesive stack may allow for replacement of the component by an authorized person applying an appropriate and deliberate force. The adhesive stack may aid in identifying components replaced by an unauthorized person.
Claims23
A method of manufacturing an adhesive stack comprising:
- dispensing a first adhesive layer from a first dispensing roll;
- dispensing a second adhesive layer from a second dispensing roll;
- dispensing a shear layer from a third dispensing roll;
- positioning the dispensed shear layer between the first dispensed adhesive layer and the second dispensed adhesive layer;
- and
- assembling the adhesive stack between a first and second compressing roll, wherein the shear layer comprises a first sub-layer, a second sub-layer, and an ink layer interposed between the first and the second sub-layers, wherein an adhesive strength of the first and second adhesive layers is greater than a bulk strength of the shear layer, and wherein said shear layer comprising a non-woven material.
A method of assembling adhesive layers, comprising:
- dispensing a first adhesive sub-layer and a first release layer with a first dispensing roll;
- dispensing a second adhesive sub-layer and a second release layer with a second dispensing roll;
- with a third dispensing roll, while dispensing the first and second adhesive sub-layers and the first and second release layers, dispensing a shear layer between the first and second adhesive sub-layers;
- and
- feeding the first and second adhesive sub-layers, the shear layer, and the first and second release layers between a first positioning roller and a second positioning roller to form an adhesive stack, wherein an adhesive strength of the first and second adhesive sub-layers is greater than a bulk strength of the shear layer and the shear layer comprises a non-woven material.
A method of manufacturing a multi-layered adhesive stack in an electronic device, comprising:
- compressing a shear layer between first and second pressure-sensitive adhesive layers, wherein the shear layer comprises a plurality of sub-layers that include at least one polymer layer and at least one ink layer,
- wherein an adhesive strength of the first and second pressure-sensitive adhesive layers is greater than a bulk strength of the shear layer, and wherein said shear layer comprising a non-woven material.
Dependencies are inferred from the claim text.