Method for shaping and slicing ingots using an aqueous phosphate solution
AssigneeFontana Technology
InventorMark Jonathan Beck
Life of this patent
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Abstract
A method for slicing a workpiece into wafers in which a polyphosphate solution is applied to the workpiece during the slicing process. The method comprises the steps of positioning the workpiece, such as a silicon ingot, in the vicinity of a wire saw that can cut through the workpiece without the use of an abrasive slurry; causing an aqueous polyphosphate solution to contact the workpiece; and causing the wire saw to cut into the workpiece while the polyphosphate solution is in contact with the workpiece. After the workpiece has been cut into wafers, the polyphosphate solution is rinsed off of the wafers. Preferably, the wire saw used in this method is a diamond wire saw.
Claims12
A method for slicing a workpiece comprising:
- a. positioning a workpiece in the vicinity of a diamond wire saw;
- b. causing a polyphosphate solution consisting of a polyphosphate, a base and water to contact the workpiece;
- c. causing the diamond wire saw to cut the workpiece into two or more sections while the polyphosphate solution is in contact with at least some of the workpiece and at least some of the two or more sections;
- and
- d. rinsing the polyphosphate solution off of at least some of the two of more sections with a rinsing solution.
Dependencies are inferred from the claim text.