Non-etching non-resist adhesion composition and method of preparing a work piece

A non-etching non-resist composition for the treatment of copper or copper alloys, the composition consisting essentially of:

• at least one mineral acid or at least one organic acid, wherein said at least one mineral acid is selected from the group consisting of sulfuric acid and phosphoric acid;
• at least one solvent selected from the group consisting of water and an organic solvent;
• at least one adhesion agent selected from the group consisting of:
• a) heterocyclic compounds comprising at least one thiol moiety, said compounds being selected from the group consisting of compounds having at least one of formulae IIIA and IIIB:
• wherein
• R6 and R7 are independently selected from the group comprising H, SR9, OR9, NR10R11 and C1-C4 alkyl;
• R8 is H or C1-C3 alkyl;
• R9 is selected from the group comprising H, Li, Na, K and NH4;
• R10 and R11 are independently selected from the group comprising H, CH3 and C2H5;
• with the proviso that at least one of R6 and R7 is SR9;
• and
• b) quaternary ammonium polymers having general chemical formula II:
• {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n2nX− II
• wherein:
• R3 and R4 are independently methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl or —CH2CH2(OCH2CH2)cOH;
• R5 is (CH2)d or {(CH2)eO(CH2)f]g;
• Y is O, S or NH;
• a, b, c, d, e and f are each independently an integer from 1 to about 6;
• g is an integer from 1 to about 4;
• n is an integer being at least 1;
• and
• X− is a halide ion, and
• wherein the composition is free of an oxidant for the copper or the copper alloys and wherein the composition is non-etching under conditions of conventional dip-tank techniques.