Light emitting diode package, method for manufacturing the same and light source unit having the LED package

#This application claims the benefit of Korean Patent Application No. 10-2009-0012965 filed on Feb. 17, 2009, which is hereby incorporated by reference as if fully set forth herein.

#1. Field of the Invention

#The present invention relates to a light emitting diode package, a method for manufacturing the same and a light source unit having the LED package and, more particularly, to a high efficiency LED package with reduced production costs, a method for manufacturing the same and a light source having the high efficiency LED package.

#The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principle of the invention. In the drawings:

#FIG. 1 is a photograph showing a light emission pattern of a light source unit using a conventional LED package;

#FIG. 2A and FIG. 2B are a plan view and a cross-sectional view schematically illustrating a light source unit according to the present invention, respectively;

#Hereinafter, an LED package, a method for manufacturing the same and a light source unit having the fabricated LED package according to the present invention will be described in detail from the following description with reference to exemplary embodiments, taken in conjunction with the accompanying drawings.

#FIG. 2A is a plan view illustrating a light source unit 10 having an LED package of the present invention and FIG. 2B is a cross-sectional view illustrating the foregoing light source unit 10, taken along the line (I-I′) in FIG. 2A. The above light source unit 10 comprises a plurality of LED packages 30 to emit light and a plurality of optical sheets 16 aligned apart from the LED packages 30 at constant intervals. The light source unit 10 may further include a printed circuit board (PCB) 38 on which the LED packages 30 are mounted, and a diffusion plate 14 to diffuse the light and a reflection plate (not shown) to reflect the light emitted from the LED packages 30.

#The plurality of LED packages 30 are aligned and spaced from one another at constant intervals. One LED package 30 comprises a mold frame 36 placed on the PCB 38, an LED 31 fixed to the mold frame 36, and a lens 32 enclosing the LED 31.