Wireless IC device
AssigneeMurata Manufacturing Co., Ltd.
InventorsYuya Dokai, Masahiro Ozawa
Life of this patent
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Abstract
A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.
Claims20
A wireless IC device comprising:
- a substrate including a first main surface and a second main surface facing the first main surface;
- a wireless IC element provided on a side of the first main surface and arranged to process a high-frequency signal;
- a first radiator including first and second ends, provided on a side of the second main surface, and coupled to the wireless IC element via a feeding circuit including a first interlayer conductor;
- and
- a second radiator including first and second ends, provided on the side of the first main surface, and coupled to the first radiator via a second interlayer conductor;
- wherein
- the wireless IC element is connected to the first end of the first radiator;
- the first end of the second radiator is connected to the second end of the first radiator;
- and
- the second end of the second radiator is not connected to the wireless IC element such that the second radiator is open.
Dependencies are inferred from the claim text.