Cards and devices with embedded holograms
AssigneeDynamics Inc.
InventorsJeffrey D. Mullen, Eric R. Nicklaus
Life of this patent
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Abstract
A card, such as a payment card, or other device may include an electronics package. The electronics package may include electronic components mounted on a flexible, printed circuit board. The electronics package may be laminated (e.g., via a hot, cold, or molding lamination process) between layers of transparent polymer. A hologram may be fixed to one side of the electronics package such that the hologram may be viewed from the exterior of the laminated card having transparent polymer layers. As such, the hologram may not be removed without breaching the integrity of a transparent polymer layer.
Claims20
A method comprising:
- affixing a hologram to a hologram region of a card layer;
- and
- printing a first material layer on the card layer such that at least a first portion of the hologram region does not include the first material layer.
A method comprising:
- affixing a signature panel to a signature region of a card layer;
- and
- printing a first material layer on the card layer such that at least a portion of the signature region does not include the first material layer.
Dependencies are inferred from the claim text.