Method of manufacturing a semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsTakeshi Matsushita, Eiji Mochizuki, Tatsuo Nishizawa, Shunsuke Saito
Life of this patent
Estimating the term…
Abstract
A soldering method achieves little void and good joint condition in soldering an insulated circuit board and a semiconductor chip using a tin-high antimony solder material. A method of manufacturing a semiconductor device includes the steps of preparing a solder plate having a U-shape; mounting the solder plate on a substrate; mounting a semiconductor chip on the solder plate; fusing the solder plate in a reducing gas atmosphere; and reducing a pressure of the reducing gas atmosphere to a pressure lower than the atmospheric pressure when melting the solder plate.
Claims8
A method of manufacturing a semiconductor device, comprising the steps of:
- preparing a solder plate having three side portions, a space surrounded by the three side portions in a central portion thereof, and an opening portion for communicating with the space to thereby form a U-shaped solder plate;
- mounting the solder plate on a substrate;
- mounting a semiconductor chip on the solder plate;
- fusing the solder plate in a reducing gas atmosphere;
- and
- reducing a pressure of the reducing gas atmosphere to a pressure lower than an atmospheric pressure when melting the solder plate,
- wherein the space in the central portion of the solder plate is arranged to communicate with the reducing gas atmosphere through the opening portion.
Dependencies are inferred from the claim text.