Organic vapor jet print head with solder joint
AssigneeThe Regents of the University of Michigan
InventorsStephen R. Forrest, Gregory McGraw
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Abstract
A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
Claims10
An organic vapor jet printing (OVJP) device, comprising:
- a nozzle plate comprising silicon and having a first surface, an opposite surface, and one or more fluid flow ports located at said first surface, and one or more fluid flow passages extending through the nozzle plate to fluidly connect each one of the fluid flow ports at said first surface with one or more fluid flow ports located at said opposite surface of the nozzle plate;
- a second plate having a second surface and one or more fluid flow ports located at said second surface, wherein said first and second surfaces oppose each other;
- a fluid source coupled with and providing organic vapor-containing fluid to said plates for deposition on a print surface via discharge of the organic vapor-containing fluid from the fluid flow ports located at said opposite surface of the nozzle plate;
- a solder joint comprising a eutectic metal alloy located between said first and second surfaces, the solder joint circumscribing the fluid flow ports located at the first and second surfaces to form a fluid-tight seal between the plates;
- a diffusion barrier layer located between the solder joint and the nozzle plate, wherein an element of the eutectic metal alloy has a diffusion rate with the diffusion barrier layer lower than a diffusion rate with the nozzle plate so that the diffusion barrier layer substantially prevents interdiffusion of the solder joint material with the nozzle plate;
- and
- an adhesion layer located between the solder joint and the nozzle plate, the adhesion layer being formed from a material different from the diffusion barrier layer, the solder joint, and the nozzle plate.
Dependencies are inferred from the claim text.