Method and apparatus for producing multiple-pane insulating glass having a high-vacuum insulation

An apparatus for producing a flat, thermally insulating structural element from substrates, which, spaced apart at a small distance from one another, are connected to one another at the borders of their periphery by applied pieces, and are insulated from one another by means of a vacuum, comprising the following features:

• a first vacuum chamber having a first airlock and a second airlock, wherein the first airlock is openable to a normal atmosphere area;
• a second vacuum chamber connected to the first vacuum chamber via the second airlock;
• a substrate-transporting device configured to support and transport the substrates generally horizontally,
• a washing device and a following drying device, each located in the normal atmosphere area, for precleaning the substrates,
• a heating device located in the normal atmosphere area for preheating the substrates, the heating device comprising a border heater and a central heater, wherein the border heater heats the border of the substrates to a first temperature and the central heater heats the substrates to a second temperature that is lower than the first temperature, wherein the border heater and central heater are each arranged adjacent the substrate-transporting device,
• an applied piece positioning device, located in the normal atmosphere area, having articulated connections and a pick up mechanism for positioning and placing the applied pieces onto the substrates,
• an ultrasonic soldering device, located in the normal atmosphere area, which solders the applied pieces placed onto the substrates in a vacuum-tight manner along the periphery,
• an automatic spacer and getter setting unit located in the normal atmosphere area for placing spacers and getter elements onto a first substrate of the substrates,
• a shuttle plate, located in the normal atmosphere area, having a plurality of fixing elements arranged in a pattern, wherein the shuttle plate is oriented horizontally and is configured to support the first substrate during placement of the spacers,
• a plasma sputtering device, located in the first vacuum chamber, for cleaning the inner side of the substrates in a vacuum,
• a substrate displacing device located at least partially within the first vacuum chamber for transporting the first substrate and a second substrate of the substrates to the first vacuum chamber
• a mechanical substrate placing device, located within the second vacuum chamber for joining together the first substrate and the second substrate in a vacuum, the substrates having been provided with the applied pieces and the spacers and the getter elements, and
• a connecting device for welding or soldering applied piece of the first substrate to applied piece of the second substrate in a vacuum chamber.