Method and apparatus for chip cooling

#The present invention relates generally to high-powered computer chips, and relates more particularly to a novel system and approach for cooling computer chips.

#The evolution toward high-powered computer chips has driven the design of heat sinks to cool the chips. Conventional heat sinks for cooling computer chips typically use fans to force air flow or use liquid cooling systems or refrigerators attached to a heat exchanger placed in intimate contact with the chip. Forced air systems become increasingly difficult to apply as chip power density increases (e.g., especially beyond 100+ W/cm2). Moreover, typical fans occupy as much as 0.3 to 0.5 of the volume of a typical computer blade (i.e., a self-contained computer server designed for high density) and are not capable of providing a flow of air that is fast enough to result in efficient cooling. Liquid cooling systems perform better in the case of high power density situations; however, they involve the risk of possible water leaks that can completely burn up the main processing chip and can seriously damage the other components in an electronic system.

#Thus, there is a need in the art for an efficient and low-risk method and apparatus for chip cooling which at the same time permits a reduced computer blade volume.

#So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only a few possible typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.

#FIG. 1 is a schematic diagram illustrating a cross-sectional view of a first embodiment of a cooling system, according to the present invention;

#FIG. 2 is a schematic diagram illustrating a cross-sectional view of a second embodiment of a cooling system, according to the present invention;

#In one embodiment, the present invention is a method and apparatus for chip cooling. Although the invention is described within the context of cooling a computer chip, it will be appreciated that embodiments of the invention may be applied to cool any kind of heat-generating device, including laser devices. Embodiments of the present invention achieve high cooling densities by expanding a fluid (e.g., air, compressed nitrogen, helium, liquid nitrogen, or the like) from a very high pressure to a very low pressure through adiabatic expansion. More specifically, some embodiments of the present invention conduct high-pressure fluid through a channel to a heat exchanger that is in thermal contact with a heat generating device (e.g., a computer chip or a laser device) and a computer blade loaded with various components, in order to take advantage of the greatly decreased fluid density, increased rate of motion, turbulence and expansion cooling. In further embodiments, fluid expanded in the heat exchanger by adiabatic expansion is used to cool downstream, low-grade heat generating devices (e.g., other components of an electronic system incorporating a computer chip).

#FIG. 1 is a schematic diagram illustrating a cross-sectional view of a first embodiment of a cooling system 100, according to the present invention. The cooling system 100 is utilized to cool a heat-generating device 102 (such as a computer chip).

#The cooling system 100 comprises a manifold 106 having an inlet 108 and a plurality of apertures 110. The inlet 108 is configured for coupling to a fluid supply, such as a hose or a pipe (not shown). The apertures 110 are formed in a surface 112 of the manifold 106. In one embodiment, the apertures 110 each have a diameter of approximately 0.4 mm and are spaced from each other by approximately 1.95 mm. Further, a plurality of grooves 114 are formed on an exterior of this surface 112. In one embodiment, the grooves 114 are approximately 1.5 mm wide and approximately 1.65 mm deep, and are formed between each pair of apertures 110. The grooves 114 duct the expanded fluid past the surface of the heat generating device 102 and out to the periphery of the heat generating device 102.