Methods for laser cutting articles from ion exchanged glass substrates
AssigneeCorning Incorporated
InventorsSinue Gomez, Lisa Anne Moore, Sergio Tsuda
Life of this patent
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AssigneeCorning Incorporated
InventorsSinue Gomez, Lisa Anne Moore, Sergio Tsuda
Estimating the term…
A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.
A method of cutting an article from a chemically strengthened glass substrate comprising:
A method of separating an article from a substrate having an inner tensile region positioned between a first and second surface compression layer, the method comprising:
A method of cutting an article from a chemically strengthened glass substrate comprising:
Dependencies are inferred from the claim text.