Method of manufacturing a capacitor-embedded printed circuit board

A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method comprising:

• forming a second conductive layer on one side of the first conductive layer;
• forming a second electrode by removing a portion of the second conductive layer;
• forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode;
• forming a dielectric layer on one side of the second electrode;
• and
• forming a third electrode in correspondence with the second electrode, wherein
• the first electrode and the second electrode are made from materials that react to different etchants,
• the first electrode does not react with a second etchant that reacts with the second electrode,
• the second electrode does not react with a first etchant that reacts with the first electrode,
• the forming the second electrode comprises removing a portion of the second conductive layer by applying the second etchant to a portion of the second conductive layer, and
• the forming the first electrode comprises removing a portion of the first conductive layer by using the second electrode as an etching resist and applying the first etchant to a portion of the first conductive layer.