Fabricating method of embedded package structure

A fabricating method of an embedded package structure, comprising:

• combining a first board and a second board to form an integrated panel;
• forming a first circuit structure on the first board and forming a second circuit structure on the second board;
• separating the first board from the second board;
• electrically disposing an embedded element on the first circuit structure;
• forming a first conductive bump on a surface of a conductive circuit substrate, the surface of the conductive circuit substrate facing a side of the first circuit structure;
• forming a second conductive bump on the second circuit structure;
• and
• providing a first semi-cured film and a second semi-cured film and performing a laminating process to laminate the first circuit structure on the first board, the first semi-cured film, the conductive circuit substrate, the second semi-cured film, and the second circuit structure on the second board, wherein the first semi-cured film and the second semi-cured film encapsulate the embedded element, the first conductive bump pierces through the first semi-cured film and is electrically connected to the first circuit structure after the laminating process is performed, and the second conductive bump pierces through the second semi-cured film and is electrically connected to the conductive circuit substrate after the laminating process is performed.