Electronic component manufacturing apparatus with opposing plates for holding electronic component during movement

An electronic component manufacturing apparatus comprising:

• a first plate having a first elastic layer on one side thereof;
• a second plate having a second elastic layer on one side thereof;
• a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof in a state where at least one electronic component chip adhering, at one surface thereof, to the first elastic layer is held between the first and second elastic layers facing each other;
• and
• a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, at least one of the first and second plates in the planar direction and a vertical direction in accordance with a turning path of the electronic component chip turned between the first and second elastic layers;
• wherein
• the second elastic layer is in contact with a first ridge of the electronic component chip located at a rear of an end surface of the electronic component chip, with respect to a travel direction of the second plate during turning of the electronic component chip;
• and
• the turning path of the electronic component chip determined by the planar movement mechanism and the vertical movement mechanism is a path drawn by a second ridge of the electronic component chip located diagonally opposite the first ridge of the electronic component chip, when the electronic component chip is turned by the planar movement mechanism and the vertical movement mechanism about the first ridge of the electronic component chip.