Semiconductor device reliability model and methodologies for use thereof

A method comprising:

• generating an aggregate reliability model using a manufacturing line distribution, wherein the aggregate reliability model is generated using reliability failure mechanisms;
• selecting a line center within a process window of the aggregate reliability model;
• assigning a percentage of the manufacturing line distribution to each performance process window bin within the process window;
• calculating a product fail rate for each of the performance process window bins, wherein the calculating the product fail rate comprises setting different fail rates for each of the reliability failure mechanisms as a function of the performance process window for each performance process window bin;
• calculating a composite fail rate for the manufacturing line distribution based on the percentage of the manufacturing line distribution assigned to each performance process window bin and the product fail rate calculated for each of the performance process window bins;
• calculating a product reliability fail rate for a semiconductor product manufactured at the selected line center such that reliability for the semiconductor product is assessed for the selected line center, wherein the product reliability fail rate is calculated based on the composite fail rate for the manufacturing line distribution;
• calculating a product reliability fail rate for a semiconductor product manufactured at the selected line center such that reliability for the semiconductor product is assessed for the selected line center, wherein the product reliability fail rate is calculated based on the composite fail rate for the manufacturing line distribution and optimizing the line center to minimize the product fail rate for each of the performance process window bins, wherein the optimizing the line center comprises:
• comparing the product reliability fail rate to a manufacturing line centering fail rate;
• determining whether the product reliability fail rate meets product reliability requirements;
• and
• utilizing a process flow to ensure that a best center line is selected to optimize the product reliability fail rate meeting the product reliability requirements, wherein the process flow includes a search to find values of an objective function given a defined domain including a variety of different types of objective functions and different types of domain;
• and
• wherein at least the step of generating the aggregate reliability model is performed using a processor.

A method comprising:

• generating an aggregate reliability model using a manufacturing line distribution of a semiconductor product;
• defining performance process window bins of a performance window for an excursion event of the semiconductor product;
• determining a fail rate for each of the performance process window bins;
• disposing of production shipment for the semiconductor product as a function of the fail rate determined for each of the performance process window bins;
• determining whether the semiconductor product is to receive a reliability screen;
• when the semiconductor product is not to receive the reliability screen, determining whether the excursion event is impacting reliability of the semiconductor product;
• identifying a failure mechanism based on the excursion event that is impacting the calculating a composite fail rate using the failure mechanism;
• comparing the composite fail rate to a target reliability;
• and
• when the composite fail rate meets the target reliability, shipping the semiconductor product,
• wherein at least the step of generating the aggregate reliability model is performed using a processor.

A method comprising:

• generating an aggregate reliability model using a manufacturing line distribution of a semiconductor product;
• defining performance process window bins of a performance window for an excursion event of the semiconductor product;
• determining a fail rate for each of the performance process window bins;
• disposing of production shipment for the semiconductor product as a function of the fail rate determined for each of the performance process window bins;
• determining whether the semiconductor product is to receive a reliability screen;
• when the semiconductor product is to receive the reliability screen, determining whether the excursion event is impacting reliability of the semiconductor product;
• identifying a failure mechanism based on the excursion event that is impacting the reliability;
• calculating a composite fail rate using the failure mechanism;
• comparing the composite fail rate to a target reliability;
• and
• when the composite fail rate meets the target reliability, shipping the semiconductor product with a standard reliability screen,
• wherein at least the step of generating the aggregate reliability model is performed using a processor.