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US 8,942,840 B2Granted
Auto device skew manufacturing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui-Long Chen, Hui-Yun Chao, Chia-Tong Ho
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Abstract
A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process.
Claims20
A system for manufacturing a semiconductor device, the system comprising
- a first module to receive device parameters and output a main recipe based at least in part on the device parameters, wherein the device parameters are parameters of devices to be manufactured;
- a second module coupled to the first module to apply a compensation variable to the main recipe to form a control recipe, the control recipe controlling a semiconductor manufacturing process tool;
- a third module coupled to the second module to receive a device offset and send the compensation variable to the second module;
- and
- a fourth module coupled to the third module to determine the device offset and send the device offset to the third module, wherein the device offset is a variable for a process to be performed on the devices to be manufactured.
2 more elements
A semiconductor manufacturing system comprising:
- a first semiconductor manufacturing tool;
- a device offset determination module to determine a device variable offset and output the device variable offset;
- and
- a first semiconductor manufacturing controller coupled to the first semiconductor manufacturing tool, the first semiconductor manufacturing controller comprising:
- a main recipe algorithm module to receive device parameters of a device to be manufactured by the first semiconductor manufacturing tool and to output a main recipe based at least in part on the device parameters of the device to be manufactured;
- and
- a compensation module coupled to the output of the main recipe algorithm module to apply a compensation variable to the main recipe and output a device tuned recipe to be used to control the first semiconductor manufacturing tool, wherein the compensation variable is at least in part dependent upon the device variable offset.
4 more elements
A semiconductor device recipe system comprising:
- a first module configured to determine a first device recipe from device parameters, wherein the device parameters are parameters of a device to be manufactured;
- and
- a second module coupled to the first module and configured to receive the first device recipe and tune the device recipe based on a compensation factor to generate a tuned device recipe to control a semiconductor manufacturing tool;
- and
- a fourth module coupled to the second module and configured to determine an offset based at least in part on a device characteristic.
2 more elements
Dependencies are inferred from the claim text.