Lead assembly for a flip-chip power switch

A power switch assembly, comprising:

• a flip-chip type integrated circuit chip including at least one distributed transistor fabricated therein, the flip-chip type integrated circuit chip having a surface with at least one first flip-chip interconnect and at least one second flip-chip interconnect, the at least one first flip-chip interconnect and the at least one second flip-chip interconnect connected to different terminals of the at least one distributed transistor;
• and
• a lead-frame with a plurality of lead sections including a first lead section and a second lead section, each of the plurality of lead sections extending in parallel with a first axis, the second lead section spaced apart from the first lead section in a second direction orthogonal to the first axis, the first lead section and the second lead section at least partially overlapping along the first axis,
• wherein each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion, the extended portion of the first lead section extends from the contact portion of the first lead section in a first direction parallel to the first axis, the extended portion of the second lead section extends from the contact portion of the second lead section in a direction opposite to the first direction, and the contact portion of the first lead section and the contact portion of the second lead section do not fully overlap along the first axis, and wherein each of the plurality of lead sections includes a first side and an opposite second side, the first side of the first lead section contacting the at least one first flip-chip interconnect, the first side of the second lead section contacting the at least one second flip-chip interconnect, the second side of the first lead section in the contact portion of the first lead section configured to contact a first contact area on a printed circuit board, and the second side of the second lead section in the contact portion of the second lead section configured to contact a second contact area on the printed circuit board.

A power switch assembly, comprising:

• a flip-chip type integrated circuit chip including at least one distributed transistor fabricated therein, the flip-chip type integrated circuit chip having a surface with a first plurality of flip-chip interconnects and a second plurality of flip-chip interconnects, the first plurality of flip-chip interconnects and the second plurality of flip-chip interconnects connected to different terminals of the at least one distributed transistor;
• and
• a lead-frame with a plurality of lead sections including a first lead section and a second lead section,
• wherein each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion, and wherein each of the plurality of lead sections includes a first side and an opposite second side, the first side of the first lead section contacting at least two of the first plurality of flip-chip interconnects, the first side of the second lead section contacting at least two of the second plurality of flip-chip interconnects, the second side of the first lead section in the contact portion of the first lead section configured to contact a first contact area on a printed circuit board located laterally beneath the integrated circuit chip, and the second side of the second lead section in the contact portion of the second lead section configured to contact a second contact area on the printed circuit board located laterally beneath the integrated circuit chip,
• wherein at least one contact portion is located at least partially laterally beneath at least one flip chip interconnect,
• wherein each of the plurality of lead sections extends in parallel with a first axis, the second lead section spaced apart from the first lead section in a second direction orthogonal to the first axis, the first lead section and the second lead section at least partially overlapping along the first axis.

A power switch assembly, comprising:

• a flip-chip type integrated circuit chip including at least one distributed transistor fabricated therein, the flip-chip type integrated circuit chip having a surface with a plurality of flip-chip interconnects connected to the at least one distributed transistor;
• and
• a lead-frame with a plurality of lead sections including a first lead section and a second lead section, each of the plurality of lead sections extending in parallel with a first axis, the second lead section spaced apart from the first lead section in a second direction orthogonal to the first axis, the first lead section and the second lead section at least partially overlapping along the first axis,
• wherein each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion, the extended portion of the first lead section extends from the contact portion of the first lead section in a first direction parallel to the first axis, the extended portion of the second lead section extends from the contact portion of the second lead section in a direction opposite to the first direction, and the contact portion of the first lead section and the contact portion of the second lead section do not fully overlap along the first axis, and wherein each of the plurality of lead sections includes a first side and an opposite second side, the first side of the first lead section contacting a first two of the plurality of flip-chip interconnects, the first side of the second lead section contacting at a second two of the second plurality of flip-chip interconnects, the second side of the first lead section in the contact portion of the first lead section configured to contact a first contact area on a printed circuit board located laterally beneath the integrated circuit chip, and the second side of the second lead section in the contact portion of the second lead section configured to contact a second contact area on the printed circuit board located laterally beneath the integrated circuit chip.

A power switch assembly, comprising:

• a flip-chip type integrated circuit chip including a first distributed transistors and a second distributed transistor fabricated therein, the flip-chip type integrated circuit chip having a surface with a first plurality of flip-chip interconnects, a second plurality of flip-chip interconnects, and a third plurality of flip-chip interconnects and a fourth plurality of flip-chip interconnects, the first plurality of flip-chip interconnects connected to a first terminal of the first distributed transistor, the second plurality of flip-chip interconnects connected to a first terminal of the second distributed transistor;
• and
• a lead-frame with a plurality of lead sections including a first lead section, a second lead section, and a third lead section
• wherein each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion, and wherein each of the plurality of lead sections includes a first side and an opposite second side, the first side of the first lead section contacting at least one of the first plurality of flip-chip interconnects, the first side of the second lead section contacting at least one of the second plurality of flip-chip interconnects, the first side of the third lead section contacting at least one of the third plurality of flip-chip interconnects, the second side of the first lead section in the contact portion of the first lead section configured to contact a first contact area on a printed circuit board, the second side of the second lead section in the contact portion of the second lead section configured to contact a second contact area on the printed circuit board, and the second side of the third second lead section in the contact portion of the third lead section configured to contact a third contact area on the printed circuit board,
• wherein the third lead section is connected through the third plurality of flip-chip interconnects to a second terminal of the first distributed transistor and to a second terminal of the second distributed transistor.

A power switch assembly, comprising:

• a flip-chip type integrated circuit chip including at least one distributed transistor fabricated therein, the flip-chip type integrated circuit chip having a surface with a first plurality of flip-chip interconnects and a second plurality of flip-chip interconnects, the first plurality of flip-chip interconnects and the second plurality of flip-chip interconnects connected to different terminals of the at least one distributed transistor;
• and
• a lead-frame with a plurality of lead sections including a first lead section, a second lead section and a third lead section, each of the plurality of lead sections extending in parallel with a first axis, the second lead section spaced apart from the first lead section in a second direction orthogonal to the first axis, the third lead section spaced apart in the second direction from the second lead section, the first lead section and the third lead section substantially overlapping the second lead section along the first axis;
• wherein each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion, the extended portion of the first lead section extends from the contact portion of the first lead section in a first direction parallel to the first axis, the extended portion of the second lead section extends from the contact portion of the second lead section in a direction opposite to the first direction, and the contact portion of the first lead section and the contact portion of the second lead section do not fully overlap along the first axis, and wherein each of the plurality of lead sections includes a first side and an opposite second side, the first side of the first lead section contacting at least one of the first plurality of flip-chip interconnects, the first side of the second lead section contacting at least one of the second plurality of flip-chip interconnects, the first side of the third lead section contacting at least another one of the first plurality of flip-chip interconnects, the second side of the first lead section in the contact portion of the first lead section configured to contact a first contact area on a printed circuit board, the second side of the second lead section in the contact portion of the second lead section configured to contact a second contact area on the printed circuit board, and the second side of the third lead section in the contact portion of the third lead section configured to contact the first contact area on the printed circuit board, and wherein the first lead section and the third lead section are joined.