PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types

A method for fabricating a printed circuit board (PCB) stackup, comprising:

• providing one or more core layers of a plurality of insulating layers where each core layer has a conductive layer of a plurality of conductive layers attached to each side thereof;
• arranging a plurality of prepreg layers of the insulating layers in relation to the core layers in alternating fashion such that the insulating layers are interleaved among the conductive layers;
• positioning a top-most conductive layer of the conductive layers above a top-most insulating layer of the insulating layers, and a bottom-most conductive layer of the conductive layers below a bottom-most insulating layer of the insulating layers;
• and
• applying pressure between the top-most conductive layer and the bottom-most conductive layer and applying heat to the insulating layers and the conductive layers to bind the insulating layers and the conductive layers to one another, resulting in the PCB stackup being fabricated,
• wherein the conductive layers comprise one or more power layers, one or more ground layers, one or more high-frequency layers over which one or more first signals having one or more first frequencies greater than a first threshold specifying a minimum high frequency are communicated, and one or more low-frequency layers over which one or more second signals having one or more second frequencies less than a second threshold specifying a maximum low frequency are communicated, each second frequency less than each first frequency,
• and wherein each insulating layer adjacent to any of the high-frequency layers has a first material type, and each insulating layer not adjacent to any of the high-frequency layers has a second material type different than the first material type.

A method comprising:

• providing a printed circuit board (PCB) stackup comprising a plurality of conductive layers and a plurality of insulating layers interleaved among the conductive layers, the insulating layers comprising one or more core layers and one or more prepreg layers arranged in alternating fashion;
• and
• attaching one or more electronic components to the PCB stackup to fabricate an electronic device comprising the PCB stackup and the electronic components,
• wherein the conductive layers comprise one or more power layers, one or more ground layers, one or more high-frequency layers over which one or more first signals having one or more first frequencies greater than a first threshold specifying a minimum high frequency are communicated, and one or more low-frequency layers over which one or more second signals having one or more second frequencies less than a second threshold specifying a maximum low frequency are communicated, each second frequency less than each first frequency,
• and wherein each insulating layer adjacent to any of the high-frequency layers has a first material type, and each insulating layer not adjacent to any of the high-frequency layers has a second material type different than the first material type.

An electronic device comprising:

• a printed circuit board (PCB) stackup comprising a plurality of conductive layers and a plurality of insulating layers interleaved among the conductive layers, the insulating layers comprising one or more core layers and one or more prepreg layers arranged in alternating fashion;
• and
• one or more electronic components attached to the PCB stackup,
• wherein the conductive layers comprise one or more power layers, one or more ground layers, one or more high-frequency layers over which one or more first signals having one or more first frequencies greater than a first threshold specifying a minimum high frequency are communicated, and one or more low-frequency layers over which one or more second signals having one or more second frequencies less than a second threshold specifying a maximum low frequency are communicated, each second frequency less than each first frequency,
• and wherein each insulating layer adjacent to any of the high-frequency layers has a first material type, and each insulating layer not adjacent to any of the high-frequency layers has a second material type different than the first material type.