Printed circuit board having electronic components embedded therein

A printed circuit board having electronic components embedded therein, comprising:

• a metal core layer having a groove part formed thereon;
• an electronic component embedded in the groove part and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer;
• a first internal insulating layer stacked on one side of the metal core layer;
• a second internal insulating layer stacked on the other side of the metal core layer;
• a first circuit pattern formed on an external surface of the first internal insulating layer;
• and
• a second circuit pattern formed on an external surface of the second internal insulating layer,
• wherein the electronic component includes a through silicon via and has the first ground terminal being connected to a second ground terminal by the through silicon via and the second ground terminal formed on the other side thereof,
• wherein the second ground terminal is connected to the metal core layer by conductive adhesive, and
• wherein the conductive adhesive is formed between a lower surface of the electronic component and the second internal insulating layer, a side of the conductive adhesive is connected to the metal core layer, and the conductive adhesive is electrically connected to the second ground terminal with the metal core layer.

A printed circuit board having electronic components embedded therein, comprising:

• a metal core layer having a cavity formed thereon;
• an electronic component embedded in the cavity and having a plurality of terminals, a first ground terminal included in the plurality of terminals being connected to the metal core layer;
• a first internal insulating layer stacked on one side of the metal core layer;
• a second internal insulating layer stacked on the other side of the metal core layer;
• a first circuit pattern formed on an external surface of the first internal insulating layers;
• and
• a second circuit pattern formed on an external surface of the second internal insulating layer,
• wherein the metal core layer has a through hole filled with insulating material and further includes a via passing through the first internal insulating layer, the insulating material and the second internal insulating layer, and
• wherein the insulating material is formed between the metal core layer and the via, the via electrically connecting the first circuit pattern to the second circuit pattern and is insulated from the metal core layer by the insulating material.