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US 8,942,003 B2Granted
Multilayered printed wiring board
AssigneeDai Nippon Printing Co., Ltd.
InventorsTakahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
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AssigneeDai Nippon Printing Co., Ltd.
InventorsTakahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
Estimating the term…
A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
A multilayered printed wiring board, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components mounted in…
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass
Manufacturing multilayer circuits: having cavities, e.g. for mounting components
About 9 months of term left · ends 27 Jul 2027 (estimated)
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2006-205641 filed on Jul. 28, 2006; the entire contents which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a multilayered printed wiring board, e.g., which is employed as a module board in a portable device and a method for manufacturing the multilayered printed wiring board.
FIG. 1A is a top plan view showing the structure of a multilayered printed wiring board according to an embodiment of the present invention.
FIG. 1B is a bottom plan view showing the structure of a multilayered printed wiring board according to an embodiment of the present invention.
FIG. 2 is a cross sectional view showing the structure of the multilayered printed wiring board in FIG. 1, taken on line A-A.
Hereinafter, the present invention will be described in detail with reference to the drawings. Like or corresponding components are designated by the same reference numerals throughout the drawings and the explanation for like or corresponding components will be omitted. The embodiments and the drawings will be described for the convenience of the understanding of the present invention so that the present invention is not limited to the embodiments and the drawings. Moreover, the drawings are schematically illustrated so that some components may be different from real ones.
First of all, a multilayered printed wiring board according to this embodiment will be described with reference to FIGS. 1 to 3. FIG. 1A is a top plan view showing the structure of the multilayered printed wiring board according to this embodiment. FIG. 1B is a bottom plan view showing the structure of the multilayered printed wiring board according to this embodiment. FIG. 2 is a cross sectional view showing the structure of the multilayered printed wiring board in FIG. 1, taken on line A-A. FIG. 3 is a cross sectional view showing the structure of a multilayered printed wiring board modified from the one shown in FIGS. 1 and 2.
As shown in FIGS. 1 and 2, the printed wiring board 100 includes a cavity 1 to insert therein an electric/electronic component from the opening thereof, areas 5 to embed other electric/electronic components 5, wiring layers 21 to 28 with the respective wiring patterns (eight wiring layers), insulating layers 11 to 13 and interlayer connection conductors 31 to 37, thereby constituting an eight-layered printed wiring board. In this embodiment, two areas 5 are provided so that two electric/electronic components 4 are embedded in the corresponding areas 5, respectively. The top of each component 5 is covered with resin.