Three dimensional passive multi-component structures

#1. Technical Field

#The described embodiments relate generally to electronic components and more particularly to three dimensional structural arrays of passive components that in some embodiments include an integrated circuit.

#2. Related Art

#The embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

#FIG. 1 is a block diagram of one embodiment of a stacked array;

#FIG. 2 is an exploded view of one embodiment of a stacked array;

#Representative applications of methods and apparatus according to the present application are described in this section. These examples are being provided solely to add context and aid in the understanding of the described embodiments. It will thus be apparent to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the described embodiments. Other applications are possible, such that the following examples should not be taken as limiting.

#The various aspects, embodiments, implementations or features of the described embodiments can be used separately or in any combination. In the following detailed description, references are made to the accompanying drawings, which form a part of the description and in which are shown, by way of illustration, specific embodiments in accordance with the described embodiments. Although these embodiments are described in sufficient detail to enable one skilled in the art to practice the described embodiments, it is understood that these examples are not limiting; such that other embodiments may be used, and changes may be made without departing from the spirit and scope of the described embodiments.

#Passive components such as capacitors, inductors, resistors, and the like are used pervasively in electronic designs. More particularly, the passive components can be mounted on to a surface of a printed circuit board (PCB) that can include electrical interconnects also referred to as traces. However, in conventional arrangements, the passive components are laterally mounted to the PCB in such a way that valuable surface area of the PCB is utilized. In this way, the component density of the PCB is adversely affected. Therefore, reducing the amount of PCB surface area dedicated to passive components can result in a both an increase in component density and ultimately a reduction in an amount of a product required to house the electronic components therein. For example, instead of laterally mounting the passive components to the surface of the PCB, at least some of the passive components can be stacked vertically having the effect of reducing the amount of PCB surface area dedicated to the passive components without affecting the functionality of the PCB. Another approach to reducing PCB surface area for mounting of passive components can rely upon embedding at least one passive component within a PCB substrate. In still other embodiments, an integrated circuit can be embedded within the PCB substrate with or without passive components.