Circuit board and heat dissipation device thereof

A circuit board, comprising,

• a substrate, having at least one positioning hole, wherein each of the at least one positioning hole has a bare metal area on a periphery of each of the at least one positioning hole;
• a chip, disposed on the substrate;
• a heat dissipation element, disposed on the chip and having at least one fixing hole;
• a conductive element comprises:
• a first junction connected electrically to the heat dissipation element, the first junction having a first through hole;
• a second junction connected electrically to the bare metal area of the substrate, the second junction having a second through hole;
• and
• a bridge portion, two ends of the bridge portion are connected electrically to the first junction and the second junction respectively, and the bridge portion provides an elastic force, so that the second junction presses against the bare metal area of the substrate;
• and
• at least one fixing part, each of the of the at least one fixing part passing sequentially through the first through hole, a respective one of the at least one fixing hole, and the second through hole to press the first junction to a surface of the heat dissipation element, and connected to a corresponding one of the at least one positioning hole, so as to fix the heat dissipation element to the substrate
• at least one fixing part, each of the of the at least one fixing part passing through a corresponding one of the at least one fixing hole and connected to a corresponding one of the at least one the positioning hole, so as to fix the heat dissipation element to the substrate.