Vapor condenser with three-dimensional folded structure

A cooling apparatus comprising:

• a housing configured to facilitate forming a compartment;
• a fluid disposed within the compartment;
• and
• a vapor condenser, the vapor condenser comprising a three-dimensional folded structure defining, at least in part, a first set of coolant-carrying channels and a second set of vapor condensing channels, the first set of coolant-carrying channels being interleaved with and extending parallel to the second set of vapor condensing channels, wherein the three-dimensional folded structure comprises a thermally conductive sheet with multiple folds therein, wherein one side of the thermally conductive sheet comprises a vapor condensing surface, the vapor condensing surface being exposed within the compartment in an upper portion of the compartment, and the second set of vapor condensing channels increasing a condensation surface area of the vapor condensing surface, and thereby facilitating cooling of fluid vapor rising to the upper portion of the compartment.

A liquid-cooled electronics rack comprising:

• a plurality of immersion-cooled electronic subsystems, at least one immersion-cooled electronic subsystem of the plurality of immersion-cooled electronic subsystems comprising:
• a housing at least partially surrounding and forming a compartment about an electronic subsystem, the electronic subsystem comprising at least one electronic component to be cooled;
• a dielectric fluid disposed within the compartment, wherein the at least one electronic component to be cooled is at least partially immersed within the dielectric fluid;
• and
• a dielectric fluid inlet and a dielectric fluid vapor outlet in fluid communication with the compartment, wherein dielectric fluid is provided to the compartment via the dielectric fluid inlet, and dielectric fluid vapor egresses from the compartment via the fluid dielectric vapor outlet;
• and
• a vapor condenser heat exchanger to facilitate condensing of dielectric fluid vapor egressing from the compartment(s) of the at least one immersion-cooled electronic subsystem, the vapor condenser heat exchanger comprising a three-dimensional folded structure defining, at least in part, a first set of coolant-carrying channels and a second set of vapor condensing channels, the first set of coolant-carrying channels being interleaved with and extending parallel to the second set of vapor condensing channels, wherein the three-dimensional folded structure comprises a thermally conductive sheet with multiple folds therein, wherein one side of the thermally conductive sheet comprises a vapor condensing surface, and an opposite side of the thermally conductive sheet comprises a coolant-cooled surface, at least a portion of the coolant-cooled surface at least partially defining the first set of coolant-carrying channels, and wherein coolant within the first set of coolant-carrying channels at least partially contacts the coolant-cooled surface of the thermally conductive sheet of the three-dimensional folded structure.