Multilayer ceramic electronic component and fabrication method thereof

A multilayer ceramic electronic component comprising:

• a ceramic main body including a dielectric layer and having first and second main faces opposed in a lamination direction of the dielectric layer, third and fourth side faces connecting the first and second main faces and opposed in a length direction, and fifth and sixth faces connecting the first and second main faces and opposed in a width direction;
• first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween within the ceramic main body;
• and
• one or more first external electrodes formed on the fifth face and electrically connected to the first internal electrodes and one or more second external electrodes formed on the sixth face and electrically connected to the second internal electrodes,
• wherein the first and second external electrodes include a conductive metal and glass and have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions,
• wherein a ratio of the content of the glass to that of the conductive metal ranges from 0.4 to 2.0.