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US 8,941,552 B2Granted
Composite printed wiring board and wireless communication system
AssigneeMurata Manufacturing Co., Ltd.
InventorsMakoto Takeoka, Koji Shiroki, Nobuo Ikemoto, Yuya Dokai
Life of this patent
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Abstract
A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.
Claims11
A composite printed wiring board comprising:
- a parent board;
- and
- a child board that is mounted on the parent board;
- wherein
- a wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board;
- and
- a second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.
4 more elements
A wireless communication system comprising:
- a composite printed wiring board that includes a parent board and a child board that is mounted on the parent board;
- wherein
- a wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board;
- and
- a second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.
2 more elements
Dependencies are inferred from the claim text.