Piezoelectric module

A piezoelectric module comprising:

• a piezoelectric package that houses a piezoelectric resonator;
• and
• a circuit component package that houses a circuit component configured to generate an oscillation signal at a predetermined frequency based on a vibration signal of the piezoelectric resonator, and the piezoelectric package and the circuit component package are electrically and mechanically bonded, wherein
• the piezoelectric package comprises:
• a first depressed portion that is formed by a first bottom wall layer and a first frame wall layer, the first depressed portion housing the piezoelectric resonator;
• a lid body that seals the first depressed portion;
• and
• a plurality of external terminals configured to output the vibration signal of the piezoelectric resonator to an outer bottom surface of the first depressed portion;
• the circuit component package comprises:
• a second depressed portion that is formed by a second bottom wall layer and a second frame wall layer, the second depressed portion housing the circuit component;
• and
• a plurality of connecting terminals disposed on an opening end surface of the second depressed portion, the plurality of connecting terminals being electrically connected to the plurality of respective external terminals on the outer bottom surface of the piezoelectric package;
• the piezoelectric module comprises an anisotropic conductive layer interposed between a whole circumference of the opening end surface of the second depressed portion and the outer bottom surface of the first depressed portion of the piezoelectric package, and the second depressed portion including the plurality of connecting terminals of the circuit component package;
• the plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by a bridging bonding,
• the bridging bonding forms a bridge by interposing a conductive filler constituting the anisotropic conductive layer by pressurization and heating at fabrication, and
• the whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of a thermoset resin that constitutes the anisotropic conductive layer.