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US 8,941,250 B1Granted
Electronic component package fabrication method and structure
AssigneeAmkor Technology, Inc.
InventorsRobert Francis Darveaux, Brett Arnold Dunlap, Ronald Patrick Huemoeller
Life of this patent
Estimating the term…
Abstract
A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.
Claims20
An electronic component package comprising:
- an electronic component comprising an active surface that comprises or has bond pads thereon;
- a redistribution pattern coupled to the active surface and electrically coupled to the bond pads, where the entire redistribution pattern is coupled to the active surface;
- a buildup dielectric layer coupled to the redistribution pattern;
- and
- a buildup circuit pattern coupled to the buildup dielectric layer, the buildup circuit pattern electrically coupled to the redistribution pattern through apertures of the buildup dielectric layer.
2 more elements
An electronic component assembly comprising:
- a semiconductor die comprising a first surface that comprises or has bond pads thereon, the first surface having a perimeter;
- a first layer of conductive traces electrically coupled to the bond pads through apertures in at least a first insulating layer, where the entirety of said first layer of conductive traces is positioned within an area bounded by the perimeter of the first surface;
- and
- a second layer of conductive traces electrically coupled to the first layer of conductive traces through apertures in at least a second insulating layer, where said second layer of conductive traces comprises traces that extend beyond the area bounded by the perimeter of the first surface.
1 more element
An electronic component assembly comprising:
- a semiconductor die comprising an active surface that comprises or has bond pads thereon, the active surface having a perimeter;
- a redistribution pattern dielectric layer (RPDL) coupled to the active surface;
- and
- a redistribution pattern coupled to the RPDL and electrically coupled to the bond pads through apertures in the RPDL, where the entire redistribution pattern is positioned within an area bounded by the perimeter of the active surface.
1 more element
Dependencies are inferred from the claim text.