Low loop wire bonding
AssigneeCarsem (M) Sdn. Bhd.
InventorsLiew Siew Har, Law Wai Ling
Life of this patent
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AssigneeCarsem (M) Sdn. Bhd.
InventorsLiew Siew Har, Law Wai Ling
Estimating the term…
A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.
A semiconductor package comprising:
A method of coupling a first end of a bonding wire to a first contact and a second end of the bonding wire to a second contact, where an upper surface of the first contact and an upper surface of the second contact are at substantially a same height and extend substantially along a plane, the method comprising:
A wire bonding method in which a wire passing through a capillary is coupled between a first contact and to a second contact, the method comprising the steps of:
Dependencies are inferred from the claim text.