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US 8,941,244 B1Granted
Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin, Long-Hua Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is in the molding compound. The cover is over a top meeting joint between the conductive plug and the molding compound. The semiconductor structure further has a dielectric. The dielectric is on the cover and the molding compound.
Claims19
A semiconductor structure, comprising:
- a molding compound;
- a conductive plug in the molding compound;
- a cover over a top meeting joint between the conductive plug and the molding compound;
- a dielectric on the cover and over the molding compound;
- and
- a semiconductor chip and a first dielectric, wherein the first dielectric is on the semiconductor chip.
3 more elements
A semiconductor structure, comprising:
- a molding compound;
- a conductive plug in the molding compound;
- a cover over a top meeting joint between the conductive plug and the molding compound, wherein the cover includes an inner edge and an outer edge and the difference between the outer edge and the inner edge is greater than 5 μm.
A semiconductor 3D package, comprising:
- a molding compound;
- a filled-via in the molding compound,
- a dielectric on the molding compound;
- and
- a divider on the molding compound, wherein the divider, the filled-via and the molding form a triple interface and the divider separates the dielectric from the triple interface.
2 more elements
A method of manufacturing a semiconductor structure, comprising:
- forming a conductive plug on a substrate;
- placing a semiconductor chip on the substrate;
- forming a first dielectric over the semiconductor chip;
- surrounding a sidewall of the conductive plug with a molding compound;
- and
- disposing a divider over a top meeting joint, wherein the top meeting joint is between the molding compound and the conductive plug.
3 more elements
Dependencies are inferred from the claim text.