Fabricating a contact rhodium structure by electroplating and electroplating composition
AssigneeInternational Business Machines Corporation
InventorsHariklia Deligianni, Xiaoyan Shao
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Abstract
A contact rhodium structure is fabricated by a process that comprises obtaining a substrate having a dielectric layer thereon, wherein the dielectric layer has cavities therein into which the contact rhodium is to be deposited; depositing a seed layer in the cavities and on the dielectric layer; and depositing the rhodium by electroplating from a bath comprising a rhodium salt; an acid and a stress reducer; and then optionally annealing the structure.
Claims16
A contact rhodium structure comprising a substrate having a dielectric layer thereon, wherein the dielectric layer has cavities therein, wherein cavities having an aspect ratio of about 4 to about 10 are filled with electroplated rhodium that is substantially free of internal seams or voids, and wherein the electroplated rhodium has a resistivity between about 5 micro-ohm-cm to about 20 micro-ohm-cm when annealed above 190° C.
Dependencies are inferred from the claim text.