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US 8,941,237 B2Granted
Semiconductor device
AssigneePS4 Luxco S.a.r.l.
InventorsYu Hasegawa, Mitsuaki Katagiri
Life of this patent
Estimating the term…
Abstract
A device includes a substrate, a semiconductor chip, first and second pads, and a first wiring layer. The substrate includes first and second surfaces. The semiconductor chip includes third and fourth surfaces. The third surface faces toward the first surface. The first and second pads are provided on the third surface. The first and second pads are connected to each other. The first wiring layer is provided on the second surface of the substrate. The first wiring layer is connected to the first pad.
Claims17
A device comprising:
- a substrate including a bonding pad thereon;
- a semiconductor chip including first and second electrode pads formed on a surface of the semiconductor chip, the semiconductor chip being mounted over the substrate;
- an opening in the substrate, the first and second electrode pads facing the opening;
- a first connector electrically coupling the first electrode pad to the second electrode pad;
- and
- a second connector including a first end that is bonded above the bonding pad on the substrate and a second end that is bonded above the first electrode pad.
3 more elements
A device comprising:
- a substrate including a plurality of bonding pads thereon;
- a semiconductor chip including a first surface defined by first and second edges opposite to each other and by third and fourth edges opposite to each other and a plurality of electrode pads formed on the first surface, the electrode pads being aligned in two lines that are in parallel with the third edge, the electrode pads including first and second electrode pads;
- an opening in the substrate, the first and second electrode pads facing the opening;
- a first wire electrically coupling the first electrode pad to the second electrode pad;
- and
- a second wire electrically coupling the first electrode pad to a corresponding one of the bonding pads on the substrate, the second wire is extended from the corresponding one of the bonding pads, passing through the opening, and terminating above the first electrode pad.
3 more elements
A device comprising:
- a substrate including first and second bonding pads thereon;
- a first semiconductor chip including first and second electrode pads formed on a first surface of the semiconductor chip, the first semiconductor chip being mounted over the substrate;
- an opening in the substrate, the first and second electrode pads facing the opening;
- a first connector electrically coupling the first electrode pad to the second electrode pad;
- a second connector including a first end that is bonded above the first bonding pad on the substrate and a second end that is bonded above the first electrode pad via the first connector;
- a second semiconductor chip including third and fourth electrode pads formed on a second surface, the second semiconductor chip being stacked over the first semiconductor chip;
- a third connector electrically coupling the third electrode pad to the fourth electrode pad, the third connector being in contact with the top surfaces of the third and fourth electrode pads;
- and
- a fourth connector including a third end that is bonded above the second bonding pad and a fourth end that is bonded above the third electrode pad via the third connector.
6 more elements
Dependencies are inferred from the claim text.