Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

A semiconductor device, comprising:

• a first substrate;
• a second substrate including a thermal conduction channel;
• a first semiconductor die disposed between the first substrate and second substrate, the first semiconductor die including a non-active surface mounted to the thermal conduction channel;
• a second semiconductor die disposed between the first semiconductor die and first substrate;
• and
• a plurality of bumps formed between the first substrate and second substrate with the first semiconductor die disposed within a height of the bumps.

A semiconductor device, comprising:

• a first substrate including an insulating material;
• a conductive layer formed vertically through the insulating material to form a thermal conduction channel;
• a second substrate mounted to the first substrate;
• a first semiconductor die mounted to the first substrate and second substrate with the first semiconductor die in thermal connection to the thermal conduction channel;
• a plurality of bumps formed between the first substrate and second substrate with the first semiconductor die disposed within a height of the bumps;
• and
• a second semiconductor die mounted to the second substrate within the height of the bumps.

A semiconductor device, comprising:

• a first substrate including a conductive layer formed through the first substrate to form a thermal conduction channel;
• a plurality of bumps formed over the first substrate;
• and
• a first semiconductor die including a non-active surface mounted to the first substrate within a height of the bumps and in thermal connection to the thermal conduction channel.

A semiconductor device, comprising:

• a first substrate including a first conductive layer formed through the first substrate to form a thermal conduction channel;
• a plurality of bumps formed over the first substrate;
• a first semiconductor die disposed over the first substrate within a height of the bumps and in thermal connection to the thermal conduction channel;
• and
• a thermal interface material disposed between the first semiconductor die and the thermal conduction channel of the first substrate.