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US 8,941,233 B1Granted
Integrated circuit package with inter-die thermal spreader layers
AssigneeAltera Corporation
InventorsTony Ngai, Arifur Rahman
Life of this patent
Estimating the term…
Abstract
Integrated circuit (IC) packages with an inter-die thermal spreader are disclosed. A disclosed IC package includes a plurality of stacked dies disposed on a package substrate. A heat spreader is disposed on a top die of the plurality of stacked dies. The IC package further includes a thermal spreader layer disposed adjacent to at least one die of the plurality of stacked dies. The thermal spreader layer may extend out of a periphery of the plurality of stacked dies and may be attached to the heat spreader through a support member.
Claims13
An integrated circuit package comprising:
- a plurality of stacked dies disposed on a substrate, wherein a given die out of the plurality of stacked dies has a width, a length, and a thickness that is less than the width and less than the length;
- a heat spreader disposed on a top die of the plurality of stacked dies;
- at least two separate thermal spreader layers, wherein each of the at least two separate thermal spreader layers is disposed adjacent to a first side of the given die of the plurality of stacked dies, wherein each of the at least two separate thermal spreader layers extends out of a periphery of the plurality of stacked dies, wherein each of the at least two separate thermal spreader layers has a length that at least extends across one of the width and the length of the given die, and wherein each of the at least two separate thermal spreader layers has first and second ends that respectively extend past first and second opposing sides of the given die;
- and
- support members that are disposed along the first and second sides of the given die, that are attached to the first and second ends of the at least two separate thermal spreader layers, and that are attached to the heat spreader.
2 more elements
An integrated circuit package comprising:
- a first die disposed on a substrate;
- a thermal spreader layer disposed on a top surface of the first die, wherein the thermal spreader layer covers a region of the top surface of the first die, leaving an exposed region on the top surface of the first die;
- a second die having a plurality of solder bumps on a bottom surface, disposed on the first die, wherein the plurality of solder bumps is in direct contact with the exposed region of the top surface of the first die, wherein first and second edges of the thermal spreader layer extend past respective first and second opposing sides of the first and second dies;
- a heat spreader, disposed on a top surface of the second die;
- and
- support members disposed along the first and second opposing sides of the first and second die, attached to the first and second edges of the thermal spreader layer, and attached to the heat spreader.
3 more elements
Dependencies are inferred from the claim text.