Metal bumps for cooling device connection
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua Chou, Yi-Jen Lai, Chun-Jen Chen, Perre Kao
Life of this patent
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Abstract
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps.
Claims20
A packaged substrate with a heat sink, comprising:
- a packaging substrate;
- a heat sink;
- and
- a semiconductor substrate, wherein the semiconductor substrate has a plurality of first-side metal bumps on a first side of the substrate physically connected to the packaging substrate, and wherein the semiconductor substrate has a plurality of second-side metal bumps on a second side of the semiconductor substrate physically connected to the heat sink, and wherein the first side and the second side of the semiconductor substrate are on opposite sides of the semiconductor substrate, the semiconductor substrate has a first region configured to generate a higher amount of heat than a second region of the semiconductor substrate, and a number of second-side metal bumps of the plurality of second-side metal bumps per unit area in the first region is greater than a number of second-side metal bumps of the plurality of second-side metal bumps per unit area in the second region.
A packaged three-dimensional integrated circuit (3DIC) with a heat sink, comprising:
- a packaging substrate;
- a heat sink;
- a 3DIC, wherein the 3DIC includes at least two levels of integrated circuits (ICs), and wherein the 3DIC has a plurality of first-side metal bumps on a first side of the 3DIC physically connected to the packaging substrate, and wherein the 3DIC has a plurality of second-side metal bumps on a second side of the 3DIC physically connected to the heat sink, and wherein the first side and the second side of the 3DIC are on opposite sides of the substrate, and a number of second-side metal bumps of the plurality of second-side metal bumps per unit area of the second side is lower at a center of the 3DIC than at a peripheral location of the 3DIC;
- and
- a casing between the 3DIC and the heat sink, wherein the casing comprises:
- a fluid inlet configured to introduce a cooling fluid into the casing;
- and
- a fluid outlet configured to allow the cooling fluid to exit the casing.
A packaged substrate with a heat sink, comprising:
- a packaging substrate;
- a heat sink;
- a semiconductor substrate, wherein the semiconductor substrate has a plurality of first-side metal bumps on a first side of the substrate physically connected to the packaging substrate, and wherein the semiconductor substrate has a conductive material attached to the heat sink on a second side of the substrate, and wherein the first side and the second side of the semiconductor substrate are on opposite sides of the semiconductor substrate;
- and
- a casing between the semiconductor substrate and the heat sink, wherein the casing comprises:
- a fluid inlet configured to introduce a cooling fluid into the casing;
- and
- a fluid outlet configured to allow the cooling fluid to exit the casing.
Dependencies are inferred from the claim text.