Electronic chip and method of fabricating the same

A method of fabricating a semiconductor chip, comprising:

• integrating an active device on a substrate;
• forming a lower interlayered insulating layer on the substrate integrated with the active device;
• forming a passive device on the lower interlayered insulating layer, the passive device including a high frequency circuit with a metal pattern formed to constitute a micro strip;
• forming an upper interlayered insulating layer to cover wholly the lower interlayered insulating layer provided with the passive device;
• and
• forming a metal layer on the upper interlayered insulating layer, and
• wherein the micro strip is separated from the metal layer by the upper interlayered insulating layer without being electrically connected to the metal layer, and forms a signal transmission line and wherein the upper interlayered insulating layer comprises forming a dielectric layer, whose dielectric constant is greater than that of the lower interlayered insulating layer.