Semiconductor module and manufacturing method thereof

A manufacturing method of a semiconductor module, and comprising:

• soldering a metal heat-dissipating substrate with a conductive-patterned insulating substrate, and the conductive-patterned insulating substrate with semiconductor chips, in a soldering furnace filled with a hydrogen atmosphere;
• soldering main circuit terminals and control terminals onto the conductive-patterned insulating substrate using a predetermined fabrication jig;
• covering with a resin case, the conductive-patterned insulating substrate having the main circuit terminals and the control terminals soldered thereon, the conductive-patterned insulating substrate being covered with the resin case from above such that upper portions of at least the main circuit terminals or the control terminals are exposed from a first opening that opens upward, and bonding a perimeter of a lower portion of the resin case to the metal heat-dissipating substrate;
• and
• fixing at least any one among the main circuit terminals and the control terminals via a resin body by inserting from a second opening and attaching beneath at least any one among the main circuit terminals and the control terminal, the resin body having a nut embedded therein, thereby placing the resin body on a footing formed inside the resin case.