Package structure and method for manufacturing same

A method for manufacturing a package structure, comprising:

• providing a package substrate, a first connection substrate, a first chip, a dielectric adhesive sheet, a second chip, and a second connection substrate, the first connection substrate comprising a plurality of third electrical contact pads, and a plurality of fourth electrical contact pads spatially corresponding to the first electrical contact pads, the first chip comprising a plurality of first electrode pads spatially corresponding to the third electrical contact pads, the second chip being connected to the first chip by the dielectric adhesive sheet, the second chip comprising a plurality of second electrode pads, and the second connection substrate comprising a plurality of fifth electrical contact pads spatially corresponding to the second electrode pads, and a plurality of sixth electrical contact pads spatially corresponding to the second electrical contact pads;
• electrically connecting each fourth electrical contact pad to the corresponding first electrical contact pad, such that the first connection substrate is arranged on the package substrate;
• electrically connecting each first electrode pad to the corresponding third electrical contact pad, such that the first chip is arranged on the first connection substrate;
• arranging the dielectric adhesive sheet on a surface of the first chip further away from the first connection substrate;
• arranging the second chip on a side of the dielectric adhesive sheet further away from the first chip;
• electrically connecting each second electrode pad to the corresponding fifth electrical contact pad, such that the second connection substrate is arranged on the second chip, and
• electrically connecting each sixth electrical contact pad to the corresponding second electrical contact pad, such that the second connection substrate is electrically connected to the package substrate.

A method for manufacturing a package structure, comprising:

• providing a package substrate, a first connection substrate, a first chip, a dielectric adhesive sheet, a second chip, and a second connection substrate, the first connection substrate comprising a plurality of third electrical contact pads, and a plurality of fourth electrical contact pads spatially corresponding to the first electrical contact pads, the first chip comprising a plurality of first electrode pads spatially corresponding to the third electrical contact pads, the second chip being connected to the first chip by the dielectric adhesive sheet, the second chip comprising a plurality of second electrode pads, and the second connection substrate comprising a plurality of fifth electrical contact pads spatially corresponding to the second electrode pads, and a plurality of sixth electrical contact pads spatially corresponding to the second electrical contact pads;
• electrically connecting each first electrode pad to the corresponding third electrical contact pad, such that the first chip is arranged on the first connection substrate;
• electrically connecting each fourth electrical contact pad to the corresponding first electrical contact pad, such that the first connection substrate with the first chip is arranged on the package substrate;
• electrically connecting each fifth electrical contact pad to the corresponding second electrode pad, such that the second chip is arranged on the second connection substrate;
• arranging the dielectric adhesive sheet on a surface of the first chip further away from the first connection substrate;
• arranging the second chip on a side of the dielectric adhesive sheet further away from the first chip;
• electrically connecting each sixth electrical contact pad to the corresponding second electrical contact pad, such that the second connection substrate is electrically connected to the package substrate.