Sealed semiconductor device having adhesive patch with inwardly sloped side surfaces

A semiconductor device comprising:

• an adhesive patch having a first surface, a second surface opposite the first surface and a plurality of first side surfaces between the first surface and the second surface;
• a semiconductor chip having a first main surface, a second main surface opposite the first main surface and a plurality of second side surfaces between the first and second main surfaces, a plurality of electrode pads formed on the first main surface, and the semiconductor chip mounted on the adhesive patch such that the second main surface is faced to the first surface of the adhesive patch;
• a plurality of external electrodes arranged along the adhesive patch, each of the external electrodes having a third surface and a fourth surface on the opposite side of the third surface, and the third surface electrically connected with the each of the electrode pads of the semiconductor chip via each of a plurality of bonding wires respectively;
• and
• a sealing body having a principal surface and a rear surface opposite the principal surface, and the semiconductor chip, the adhesive patch and the external electrodes sealed in the sealing body,
• wherein the first surface of the adhesive patch is larger than the second surface of the adhesive patch,
• wherein the first side surfaces of the adhesive patch are inwardly sloped from the second side surfaces of the semiconductor chip, and
• wherein the second surface of the adhesive patch and the fourth surfaces of the external electrodes are exposed on the rear surface of the sealing body.