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US 8,941,221 B2Granted
Semiconductor package
AssigneeMediatek Inc.
InventorNan-Jang Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a die pad, at least one semiconductor die mounted on the die pad, a plurality of leads disposed along peripheral edges of the die pad, at least one connecting bar for supporting the die pad, a first power bar disposed on one side of the connecting bar, a second power bar disposed on the other side of the connecting bar, and a connection member traversing the connecting bar and electrically connecting the first power bar with the second power bar.
Claims17
A semiconductor package, comprising:
- a die pad;
- a first semiconductor die mounted on the die pad;
- a plurality of inner leads comprising a first power lead and a second power lead disposed along peripheral edges of the die pad;
- at least one connecting bar for supporting the die pad;
- a first power bar disposed on one side of the connecting bar, wherein the first power bar is integrally connected to the first power lead;
- a second power bar disposed on the other side of the connecting bar;
- and
- a connection member traversing the connecting bar and electrically connecting the first power bar with the second power bar.
5 more elements
A semiconductor package, comprising:
- a die pad;
- a least one semiconductor die mounted on the die pad;
- a plurality of inner leads in a first horizontal plane along peripheral edges of the die pad, wherein the inner leads comprise a power lead;
- a plurality of connecting bars for supporting the die pad;
- and
- a power ring circumventing the die pad, wherein the power ring is composed of a plurality of power bars extending between the connecting bars, and wherein the power bars are electrically connected together with connection members traversing the connecting bars, wherein at least one of the power bars is integrally connected to the power lead.
3 more elements
Dependencies are inferred from the claim text.