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US 8,941,220 B2Granted
Power module package and system module having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Soo Kim, Young Ki Lee, Seog Moon Choi, Sung Keun Park
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Abstract
Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
Claims13
A power module package, comprising:
- a first substrate having first semiconductor chips mounted thereon;
- and
- a second substrate having second semiconductor chips mounted thereon, the second substrate being vertically coupled with the first substrate such that a side surface in a thickness direction of the second substrate is disposed on an upper surface of the first substrate,
- wherein the first substrate further comprises a coupling unit electrically connected to the first semiconductor chips and coupled with the second substrate,
- wherein the power module package further comprises a sealing resin having an insertion groove and wrapping the side surface and the upper surface of the first substrate,
- wherein the insertion groove exposes the coupling unit therethrough and part of the second substrate is inserted into the insertion groove,
- wherein the second substrate is detachably coupled with the first substrate by the coupling unit through the insertion groove,
- wherein first catching protrusions facing each other are formed on an upper portion of an inside of the coupling unit,
- wherein first catching grooves corresponding to the first catching protrusions are formed in upper and lower portions of one end in a length direction of the second substrate,
- wherein second catching protrusions facing each other are formed on an upper portion of an inside of the insertion groove, and
- wherein second catching grooves corresponding to the second catching protrusions are formed in upper and lower portions of one end in a length direction of the second substrate.
8 more elements
A system module, comprising:
- a power module package including a first substrate having first semiconductor chips mounted thereon, a second substrate having second semiconductor chips mounted thereon, the second substrate being vertically coupled with the first substrate such that a side surface in a thickness direction of the second substrate is disposed on an upper surface of the first substrate, and a lead frame having one end connected to the first substrate and the other end protruded to the outside;
- and
- a main board substrate coupled with the other end of the lead frame protruded to the outside to allow the power module package to be installed thereon, the main board substrate having a slot with a size corresponding to the second substrate having the second semiconductor chips,
- wherein the first substrate further comprises a coupling unit electrically connected to the first semiconductor chips and coupled with the second substrate,
- wherein the power module package further comprises a sealing resin having an insertion groove and wrapping the side surface and the upper surface of the first substrate,
- wherein the insertion groove exposes the coupling unit therethrough and part of the second substrate is inserted into the insertion groove,
- wherein the second substrate is detachably coupled with the first substrate by the coupling unit through the insertion groove,
- wherein first catching protrusions facing each other are formed on an upper portion of an inside of the coupling unit,
- wherein first catching grooves corresponding to the first catching protrusions are formed in upper and lower portions of one end in a length direction of the second substrate,
- wherein second catching protrusions facing each other are formed on an upper portion of an inside of the insertion groove, and
- wherein second catching grooves corresponding to the second catching protrusions are formed in upper and lower portions of one end in a length direction of the second substrate.
8 more elements
Dependencies are inferred from the claim text.